Silicone laser marking can avoid edge burning by optimizing parameters
Laser marking, as a high-precision, non-contact processing method, is widely used for surface marking on various materials. However, silicone, a soft material susceptible to thermal effects, is prone to edge burning during laser marking, which affects marking quality and product aesthetics. This article will detail how to avoid edge burning in silicone by optimizing laser marking parameters.
I. Causes of burn edges in silicone laser marking
Burn edges primarily result from excessive laser energy or prolonged exposure time, causing localized overheating of the silicone surface, leading to carbonization or melting. This not only affects marking clarity and aesthetics but may also reduce the physical properties of the silicone.
II. Methods for Optimizing Laser Marking Parameters
(1) Reduce Laser Power
Laser power is one of the key parameters affecting marking quality. Excessively high power can cause the silicone surface to overheat, leading to burn edges. It is recommended to start testing at a lower power level and gradually adjust to an appropriate power range. For example, for silicone materials, the power can be set between 20% and 40% to avoid excessive carbonization.
(2) Increasing Marking Speed
Marking speed determines the dwell time of the laser beam on the silicone surface. Slower speeds can cause excessive accumulation of laser energy in localized areas, leading to edge burning. Therefore, appropriately increasing the marking speed can reduce localized energy accumulation and prevent edge burning. It is generally recommended to set the speed between 500-1000 mm/s.
(III) Adjusting the pulse frequency
The pulse frequency affects the density of laser pulses. A higher frequency can distribute laser energy more uniformly across the silicone surface, reducing the risk of local overheating. It is recommended to set the pulse frequency between 30-50 kHz. This ensures marking clarity while effectively avoiding burn marks.
(4) Optimize the fill spacing
The fill spacing determines the distance between lines during laser marking. A smaller fill spacing can make the markings more delicate, but it also increases the local accumulation of laser energy. Therefore, the fill spacing should be adjusted reasonably according to actual needs, with a general recommendation of 0.05-0.1 mm. This ensures marking quality while reducing edge burning.
III. Practical Application Cases
In practical applications, optimizing the above parameters can significantly reduce burn-in phenomena in silicone laser marking. For example, when marking silicone components in medical devices, setting the power to 30%, speed to 800 mm/s, pulse frequency to 40 kHz, and fill spacing to 0.08 mm successfully avoided burn-in phenomena, achieving clear and aesthetically pleasing markings.
IV. Summary
The burning edge phenomenon that occurs during silicone laser marking can be effectively avoided by optimizing laser marking parameters. By reducing laser power, increasing marking speed, adjusting pulse frequency, and optimizing fill spacing, thermal damage to the silicone surface can be minimized while maintaining marking quality. In practical applications, it is recommended to adjust parameters based on specific materials and marking requirements and conduct multiple tests to identify the optimal parameter combination.
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